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| MEMS/MOEM Packaging (Mcgraw-Hill Nanoscience and Technology) |
pages | Sep 22 2010 |ISBN: | PDF | 5.5 Mb
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability.
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